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Pressure
On-Chip Temperature Compensation and Calibration
Figure 3 shows the minimum, maximum and typical output
characteristics of the MPX2050 series at 25 ° C. The output is
directly proportional to the differential pressure and is
essentially a straight line.
The effects of temperature on Full-Scale Span and Offset
are very small and are shown under Operating
Characteristics.
40
V S = 10 Vdc
35
30
25
20
15
10
5
0
T A = 25 ° C
MPX2050
P1 > P2
MAX
TYP
MIN
Span
Range
(Typ)
-5
kPa 0
PSI
12.5
1.8
25
3.6
37.5
5.4
50
7.25
Offset
(Typ)
Figure 3. Output versus Pressure Differential
Silicone
Stainless Steel
Die Coat
Die
Metal Cover
Wire Bond
P1
Epoxy
Case
Lead Frame
P2
RTV Die
Bond
Figure 4. Cross-Sectional Diagram (not to scale)
Figure 4 illustrates the differential or gauge configuration
in the basic chip carrier (Case 344). A silicone gel isolates the
die surface and wire bonds from the environment, while
allowing the pressure signal to be transmitted to the silicon
diaphragm.
The MPX2050 series pressure sensor operating
characteristics and internal reliability and qualification tests
are based on use of dry air as the pressure media. Media
other than dry air may have adverse effects on sensor
performance and long term reliability. Contact the factory for
information regarding media compatibility in your application.
MPX2050
Sensors
Freescale Semiconductor
5
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